Custom Glass Wafers for Semiconductor, Optoelectronics, and

Price: 10

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  Diameter Options:
  
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    Standard: 2", 3", 4", 6", 8"
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    Custom: From 10 mm to 300 mm (larger sizes upon request)
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  Thickness Range:
  
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    From 0.1 mm ultra-thin to 5 mm thick for high-pressure or optical systems
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  Surface Quality:
  
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    Ground, single-side polished (SSP), or double-side polished (DSP)
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    Surface roughness: down to <1 nm RMS
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    Flatness: λ/10, TTV < 5 µm available for high-precision needs
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  Edge Options:
  
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    Flat, notch, beveled, or laser-cut edge geometries
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    SEMI standard edge finish or application-specific treatment
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  Optional Add-ons:
  
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    AR / ITO / dielectric coatings
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    Alignment marks, photomask pre-patterning
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    Thermal cleaning or vacuum packaging

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  Semiconductor Processing – Carrier wafers, RDL/interposer platforms, wafer-level packaging
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  Microfluidics & BioMEMS – Channel substrates, bonding cover glass, transparent lab-on-chip bases
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  Optoelectronics – Waveguide substrates, LED test wafers, laser cavity spacers
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  Photovoltaics – Conductive coatings on glass wafers for solar device prototyping
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  Optical Measurement & Testing – Metrology-grade substrates, reference flats, calibration plates

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  Precision CNC, laser and ultrasonic cutting for clean, crack-free edges
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  Strict flatness, TTV and parallelism control for wafer bonding and lithography
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  Compatible with wafer-level automation: vacuum chucks, pick-and-place, UV bonding
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  Small batch prototyping to mass production support
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  Fast lead time, engineering drawings review, and technical consultation available