Name | TSP | |
CJM2/4-75 S/Z | CJM2/4-85 S/Z | |
Appearance Size | L1876mm*W1640mm*H1600士25mm L2437mm*W1705mm*H1600士25mm | L1876mm*W1705mm*H1600士25mm L2437mm*W1640mm*H1600士25mm |
Max | CJM214-75S/Z: 680mm*680mm | CJM2/4-855/Z:762mm*762mm |
Min | 220mm* 220mm | |
Substrate Thickness | 0.2~ 3.2mm /0.5~ 10.0mm | |
Production Speed | 1.5~3.0M/Min adjustable speed range 1.0~5.0 M/Min | |
Total weight of the machine | About 3.0T(4-axis) | |
Applicable Process | Resin Plug Hole Grinding, Deburring, Removing Copper Particles, Dry Film Pre-treatment |