Contact person: Ms. Grace Lee
Position:
Address: No.62, Xinye Road, Huangpu District, Guangzhou City, Guangdong Province
Country: China
Phone: - Mobi: +86-20-32222928-6197

LED Encapsulation Materials for General Lighting

Price:  

Good adhesion to metals, chips and other substrates
Good sulfur resistance and thermal shock performance
Translucent appearance
Applications
● Encapsulation for LED lighting components
● Encapsulation for LED backlight components
● Encapsulation for Auto LED lighting components
It is a kind of two-part, high temperature cure silicone resin, which is designed for SMD LED encapsulation and suitable for protection of chips and gold wire. The typical features are translucent appearance, good light transmission, sulfur resistance, excellent thermal shock performance, and good adhesion to frame and silver-plated coatings.
Specifications
Properties810381057097S8232709882258136822850045005S81577136
Mix ratio1:101:101:101:101:101:101:101:101:41:41:11:10
Viscosity520040004600400053003500430045004000420036004000
Refractive Index1.551.541.551.541.541.521.541.501.541.541.411.41
Cure Condition100℃*1hr, 150℃*3hr100℃*1hr, 150℃*3hr100℃*1hr, 150℃*3hr100℃*1hr, 150℃*3hr100℃*1hr, 150℃*3hr100℃*1hr, 150℃*3hr100℃*1hr, 150℃*3hr100℃*1hr, 150℃*3hr100℃*1hr, 150℃*3hr100℃*1hr, 150℃*3hr100℃*1hr, 150℃*3hr100℃*1hr,
150℃*3hr
Shore HardnessD74D62D66D62D62D65D49D45A78A75A70A55
Tensile Strength Mpa12.511.07.011.06.57.03.03.02.02.56.5
LED encapsulation materials are specialized compounds used to encapsulate LED chips, providing protection from moisture, dust, and mechanical damage. These materials also enhance the optical performance of LEDs by improving light output and color stability. Common types of encapsulation materials include optical encapsulants and silicone materials for led, such as epoxy resins, silicone, and polyurethane. Choosing the right material can have a significant impact on the performance and durability of your LED products.
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