Contact person: Mr. Molly Mao
Position:
Address: Room 413, F Building, No. 9 East District, Shangxue Technology zone, Bantian Street, Longgang, Shenzhen, China.
Country: China
Phone: - Mobi: 86-13823362183

Fr4 Laminate ENIG Double Sided PCB

Price:  

Product Description
Introduction
As a kind of Double-sided Fr4 pcb, it is widely used in Computer and NB, Instruments, Consumer electronics, Automotive electronics etc.
Halogen, antimony and red phosphorous free
Excellent thermal reliability
L Z CTE
Anti-CAF capability
fr4 laminate double sided pcb supplier:SEMSHINE
2. Material: Fr4 Laminate pcb
Test ItemTest Method
(IPC-TM-650)
Test ConditionUnitSpecificationTypical Value
ThermalThermal
Stress
24.13.1Float 288℃/UnetchedSec≥10≥240
Glass Transition
(Tg)
2.4.25E-2/105 DSC≥10175
CTE/ Z-Axis Expansion2.4.24Alpha 1ppm/℃≤6040
Alpha 2≤300200
50 - 260 ℃%≤3.02.2
X/Y CTE2.4.2440℃ - 125℃ppm/℃——12/15
T-2602.4.24.1TMAmin≥30>60
T-2882.4.24.1TMAmin≥15>60
TD(5% weight loss)2.4.24.6TGA>340385
FlammabilityUL94E-24/ 23RatingV-0V-0
ElectricalSurface Resistivity2.5.17.1C-96/35/90≥1043.7*108
Volume Resistivity2.5.17.1C-96/35/90MΩ-cm≥1064.3*109
Dielectric Breakdown2.5.6D-48/ 50+D0.5/ 23kV≥40≥45
Dielectric Constant2.5.5.2Etched
(RC 50%)
@ 1 MHz
@ 1 GHz
≤5.44.8
4.6
Loss Tangent2.5.5.2Etched
(RC 50%)
@ 1 MHz
@ 1 GHz
≤0.0350.012
0.013
CTIIEC60112AV——>600
Arc Resistance2.5.1D-48/ 50+D-0.5/ 23Sec≥60121
MechanicalPeel Strength (1 oz.)2.4.8125 ℃N/mm≥0.701.3
Float 288 ℃/ 10 Sec≥1.051.4
After Process Solution≥0.801.1
Flexural Strength2.4.4Length DirectionN/mm2≥415602
Cross Direction≥345534
Moisture Absorption2.6.2.1D-24/23%≤0.50.11

3. Certification: UL, ROHS, Reach, ISO
4. Use range: Lighting, Automotive electronic equipment, Power supply, Electronic control, Computer equipment, Communication electronics etc.
5. What exhibitions have we participated?
New Delhi Exhibition, Moscow Electronic Exhibition etc.
6. Our Services
1.Quick response
2.Reasonable price based on good quality
3.Provide one-stop service(components, OEM)
4.Abundant inventory & Habitual material preparation
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